The Connected Future: Exploring the Internet of Packaging Market
The Global Internet of Packaging Market size was reasonably estimated to be approximately USD 23970 Million in 2023 and is poised to generate revenue over USD 47850 Million by the end of 2030, projecting a CAGR of around 10.30% from 2023 to 2030.
The Internet of Packaging (IoP) market is experiencing rapid growth and transformation, driven by the convergence of traditional packaging with cutting-edge digital technologies. IoP refers to the integration of smart sensors, RFID tags, and other connected devices into product packaging, allowing for real-time data collection, monitoring, and interaction. This market is a vital component of the broader Internet of Things (IoT) ecosystem and is poised for substantial expansion in the coming years.
Leading players involved in the Internet of Packaging Market include:
"Avery Dennison Corporation (US), Smartrac N.V. (Netherlands), BASF SE (Germany), Thin Film Electronics Asa (Norway), Stora Enso Oyj (Finland), Tetra Pak (Switzerland), Kezzler (Norway), Digimarc Corporation (US), Evrythng Limited (UK), Thinfilm Electronics Ab (Sweden), Scanbuy Inc. (US), Identiv Inc. (US), Smartglyph Ltd. (UK), E Ink Holdings Inc. (Taiwan), Paksense Inc. (US), Schreiner Group Gmbh & Co. Kg (Germany), Smart Label Solutions (Spain), Gao Rfid Inc. (Canada), Systech International (Us), Tracelink Inc. (US) and Other Major Players."
The Global Internet of Packaging Market size was reasonably estimated to be approximately USD 23970 Million in 2023 and is poised to generate revenue over USD 47850 Million by the end of 2030, projecting a CAGR of around 10.30% from 2023 to 2030.
The Internet of Packaging (IoP) market is experiencing rapid growth and transformation, driven by the convergence of traditional packaging with cutting-edge digital technologies. IoP refers to the integration of smart sensors, RFID tags, and other connected devices into product packaging, allowing for real-time data collection, monitoring, and interaction. This market is a vital component of the broader Internet of Things (IoT) ecosystem and is poised for substantial expansion in the coming years.
Leading players involved in the Internet of Packaging Market include:
"Avery Dennison Corporation (US), Smartrac N.V. (Netherlands), BASF SE (Germany), Thin Film Electronics Asa (Norway), Stora Enso Oyj (Finland), Tetra Pak (Switzerland), Kezzler (Norway), Digimarc Corporation (US), Evrythng Limited (UK), Thinfilm Electronics Ab (Sweden), Scanbuy Inc. (US), Identiv Inc. (US), Smartglyph Ltd. (UK), E Ink Holdings Inc. (Taiwan), Paksense Inc. (US), Schreiner Group Gmbh & Co. Kg (Germany), Smart Label Solutions (Spain), Gao Rfid Inc. (Canada), Systech International (Us), Tracelink Inc. (US) and Other Major Players."
9 months ago
