Die attach machines, also known as die bond machines or die mount machines are used in the semiconductor package process to attach silicon chips to die pads or die cavities. Epoxy, soft solder, sintering, eutectic, and other types of connection techniques are widespread. Die attach machines are used in RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LEDs, and other applications in a variety of industries

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