Advanced Chip Packaging Market is Anticipated to Witness High Growth Owing to Integration of Heterogeneous Systems

The Advanced Chip Packaging Market encompasses a variety of packaging solutions—such as flip-chip, fan-out wafer-level packaging (FOWLP), 2.5D/3D IC integration, and system-in-package (SiP)—designed to meet soaring demand for miniaturization, enhanced thermal management, and superior electrical performance.

These advanced packaging technologies offer significant advantages over traditional wire-bond and ceramic packages by enabling higher I/O density, reduced interconnect length, and improved signal integrity.

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